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Semiconductor Wafer Patterning, Scribing & Marking System

A compact benchtop laser system for patterning, scribing and marking silicon and related semiconductors — high-peak-power NIR pulses remove material with minimal thermal damage. Designed and manufactured in India.

SP2L-SWPSMS Wafer Processing Designed & built in India
> 5 kW NIR peak power
150 × 150 mm Pattern area
Si + III–V Materials
The system

Wafer-level precision, made in India.

A compact benchtop laser system for patterning, scribing and marking silicon and related semiconductors — high-peak-power NIR pulses remove material with minimal thermal damage. Designed and manufactured in India.

Features & capabilities

Every subsystem, purposefully designed

  1. High-peak-power NIR source — > 5 kW peak

    Material removed faster than heat diffuses, so the heat-affected zone on the device layer stays minimal.

  2. Pattern area — 150 × 150 mm

    Benchtop envelope covering research wafer sizes.

  3. Materials — Si and III–V

    Silicon and compound semiconductors including III–V materials.

  4. Wafer handling — Low-stress

    Chuck and handling designed to hold the wafer without inducing stress or contamination.

  5. Vision alignment — Machine vision

    Fiducial recognition and wafer registration before processing begins.

  6. Marking & patterning — Programmable

    Traceability codes, patterns and scribe paths defined in software.

  7. Debris extraction — Integrated

    Extraction to protect the device surface.

  8. SPPL software — Windows

    Recipe management, wafer maps, logging, traceability records and export.

  9. Support & warranty — 1 year, in-country

    One year warranty from acceptance, minimum five years spares, training included.

Principle of operation

Why wafer processing is a different problem

A wafer is thin, brittle, expensive, and carries devices whose features are measured in micrometres. A laser process that works on a steel plate will crack it, contaminate it, or damage neighbouring die through heat conduction. High peak power delivered in short pulses is the answer: material is removed faster than heat can diffuse into the surrounding structure, so the device layer beside the cut is left undamaged. That is why peak power, not average power, is the specification that matters here.

Applications

Where this system is used

Wafer patterning and scribing
Dicing-street preparation
Traceability marking
Thin-film removal
Silicon and III–V processing
Semiconductor R&D
MEMS fabrication
Failure analysis preparation
Software & connectivity

SPPL software, written and supported by us

Our Windows application handles live view, regions of interest, minimum, maximum and average values, trend plots and alarms, with export to Excel and MP4 and retention of raw data for re-analysis later. An SDK is available where the system is being embedded into your own application.

Because the software is ours, a change you need is a change we can make — you are not waiting on an overseas vendor's release cycle.

StageInterfacePurpose
SP2L-SWPSMSEthernetData and control from the system
SPPL SoftwareWindows applicationAcquisition, analysis, logging, export
I/O moduleDigital / analogueSignals to plant equipment
PLC / SCADAYour control systemLine integration and process control
Warranty & support

Supported in India, by the people who built it

Warranty

1 year

From acceptance at your site, not from dispatch.

Spares

5 years minimum

Spares availability guaranteed for at least five years.

Service

On site, in India

Our own engineers, in your time zone.

Training

Included

Your operators trained on the installed system.

Specification note

Specifications are configurable and subject to change without notice; the final configuration is confirmed per application at the time of quotation.

Request a quotation for the SP2L-SWPSMS.

Tell us the material, the feature size and the throughput you need, and we will configure the system around it.

Request a Quote +91 93231 92750